1. The new combined working platform makes maintenance more convenient.
2. Heating up and down at the same time, especially suitable for removing BGA and other chips that need to be preheated.
3. It can be adjusted according to the size of the circuit board.
4. The functional device for vacuum suction and release of chips can be selected according to needs.
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QUICK 853 hot air preheating station | QUICK 854 infrared preheating station |
Large bracket size (800L) | 382*300*110mm | about 3.5Kg |
Small bracket size (800S) | 216*180*82mm | about 3.8Kg |
